This project is to develop high Q inductor arrays on Selective Oxidized Porus Silicon (SOPS) substrate for mobile telecommunication applications. The inductors are fabricated using BCB process and 10 um Cu metallization process on the thick oxide layer of Si substrate. Theinductors may be made to have Ti/Au pads for wire bonding and to have solder balls for direct flip-chip bonding. All the fabricated inductor arrays show very good RF performance in spite of small form factor.